Photovoltaic module with transparent perimeter edges

ABSTRACT

A system includes a plurality of photovoltaic modules, each having at least one solar cell, an encapsulant encapsulating the solar cell, a frontsheet, and a backsheet. The encapsulant and the frontsheet are transparent. The backsheet includes a first section and a second section juxtaposed with the first section. The first section is transparent and the second section is non-transparent. A first end of the frontsheet, a first end of the encapsulant, and the first section of the backsheet form a transparent portion. A first photovoltaic module overlays at least a portion of a second photovoltaic module. The transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.17/738,292, filed May 6, 2022, entitled “PHOTOVOLTAIC MODULE WITHTRANSPARENT PERIMETER EDGES”, which claims the benefit of U.S.Provisional Patent Application Ser. No. 63/185,091, filed May 6, 2021,entitled “PHOTOVOLTAIC MODULE WITH TRANSPARENT PERIMETER EDGES,” thecontents of which are incorporated herein by reference in theirentirety.

FIELD OF THE INVENTION

The present invention relates to building integrated photovoltaicmodules, and, more particularly, building integrated photovoltaicmodules having transparent perimeters for improving energy densitythereof.

BACKGROUND

Photovoltaic systems having solar panels are commonly installed onroofing of structures.

SUMMARY

In some embodiments, a system includes a plurality of photovoltaicmodules, each of the photovoltaic modules includes at least one solarcell; an encapsulant encapsulating the at least one solar cell, whereinthe encapsulant includes a first end, a second end opposite the firstend, a first surface extending from the first end to the second end, anda second surface opposite the first surface and extending from the firstend to the second end, wherein the encapsulant is transparent; afrontsheet juxtaposed with the first surface of the encapsulant, whereinthe frontsheet includes a first end and a second end opposite the firstend of the frontsheet, wherein the frontsheet is transparent; and abacksheet juxtaposed with the second surface of the encapsulant, whereinthe backsheet includes a first section, and a second section juxtaposedwith the first section, wherein the first section is transparent,wherein the second section is non-transparent, wherein the first end ofthe frontsheet, the first end of the encapsulant, and the first sectionof the backsheet form a transparent portion, wherein a firstphotovoltaic module of the plurality of photovoltaic modules overlays atleast a portion of a second photovoltaic module of the plurality ofphotovoltaic modules, and wherein the transparent portion of the firstphotovoltaic module overlays at least a portion of the at least onesolar cell of the second photovoltaic module.

In some embodiments, each of the photovoltaic modules includes a firstedge, and a second edge opposite the first edge, wherein the firstsection extends from the first edge to a first location intermediate thefirst edge and the second edge, and wherein the second section extendsfrom the first location to the second edge. In some embodiments, thebacksheet includes a first surface, a second surface opposite the firstsurface of the backsheet, a first side extending from the first edge tothe second edge, and a second side opposite the first side and extendingfrom the first edge to the second edge, wherein the first sectionextends from the first side to the second side and from the firstsurface to the second surface. In some embodiments, the second sectionextends from the first side to the second side and from the firstsurface of the backsheet to the second surface of the backsheet. In someembodiments, the first section includes a width measured from the firstedge to the first location. In some embodiments, the width is 5 mm to 30mm.

In some embodiments, each of the plurality of photovoltaic modulesincludes an adhesive juxtaposed with the backsheet, and wherein theadhesive is transparent. In some embodiments, the adhesive is juxtaposedwith the first section. In some embodiments, the adhesive issubstantially aligned with the first section. In some embodiments, theadhesive optically couples the first photovoltaic module with the secondphotovoltaic module. In some embodiments, each of the photovoltaicmodules includes a creepage distance extending from the first edge to afirst end of the at least one solar cell. In some embodiments, thecreepage distance is equal to the width of the first section of thebacksheet. In some embodiments, the transparent portion of the firstphotovoltaic module overlays the at least one solar cell at an overlapdistance. In some embodiments, the overlap distance is less than orequal to the creepage distance. In some embodiments, the firstphotovoltaic module overlaps the second photovoltaic module of adistance twice the creepage distance. In some embodiments, the firstsection includes a first layer and the second section includes a secondlayer. In some embodiments, each of the photovoltaic modules includes afirst edge, and a second edge opposite the first edge, wherein the firstlayer extends from the first edge to the second edge, and wherein thesecond layer extends from the second edge to a first locationintermediate the first edge and the second edge.

In some embodiments, a photovoltaic module includes at least one solarcell; an encapsulant encapsulating the at least one solar cell, whereinthe encapsulant includes a first end, a second end opposite the firstend, a first surface extending from the first end to the second end, anda second surface opposite the first surface and extending from the firstend to the second end, wherein the encapsulant is transparent; afrontsheet juxtaposed with the first surface of the encapsulant, whereinthe frontsheet includes a first end and a second end opposite the firstend of the frontsheet, wherein the frontsheet is transparent; and abacksheet juxtaposed with the second surface of the encapsulant, whereinthe backsheet includes a first section, and a second section juxtaposedwith the first section, wherein the first section is transparent,wherein the second section is non-transparent, wherein the first end ofthe frontsheet, the first end of the encapsulant, and the first sectionof the backsheet form a transparent portion, wherein the transparentportion of the photovoltaic module is configured to overlay at least aportion of at least one solar cell of another photovoltaic module.

In some embodiments, a system includes a plurality of photovoltaicmodules, each of the photovoltaic modules includes at least one solarcell; an encapsulant encapsulating the at least one solar cell, whereinthe encapsulant includes a first end, a second end opposite the firstend, a first surface extending from the first end to the second end, anda second surface opposite the first surface and extending from the firstend to the second end, wherein the encapsulant is transparent; afrontsheet juxtaposed with the first surface of the encapsulant, whereinthe frontsheet includes a first end and a second end opposite the firstend of the frontsheet, wherein the frontsheet is transparent; and abacksheet juxtaposed with the second surface of the encapsulant, whereinthe backsheet includes a first section, wherein the first sectionincludes a beveled portion, and wherein a first photovoltaic module ofthe plurality of photovoltaic modules overlays at least a portion of asecond photovoltaic module of the plurality of photovoltaic modules, andwherein the beveled portion of the first photovoltaic module overlays atleast a portion of the at least one solar cell of the secondphotovoltaic module. In some embodiments, the beveled portion includes areflective portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a side schematic view of an embodiment of a photovoltaicmodule;

FIG. 2 shows a side schematic view of an embodiment of a frontsheetemployed by the photovoltaic module of FIG. 1 ;

FIG. 3A shows a top plan view of an embodiment of a backsheet employedby the photovoltaic module of FIG. 1 , while FIG. 3B shows a top planview of another embodiment of a backsheet;

FIG. 4 shows a side schematic view of an embodiment of a system of aplurality of the photovoltaic modules shown in FIG. 1 ;

FIG. 5 illustrates an embodiment of photovoltaic modules;

FIG. 6 shows a side schematic view of an embodiment of a photovoltaicmodule;

FIG. 7 shows a side schematic view of an embodiment of a photovoltaicmodule;

FIG. 8 shows a side schematic view of an embodiment of a system of aplurality of photovoltaic modules; and

FIG. 9 shows a side schematic view of an embodiment of a system of aplurality of photovoltaic modules.

DETAILED DESCRIPTION

The present invention will be further explained with reference to theattached drawings, wherein like structures are referred to by likenumerals throughout the several views. The drawings shown are notnecessarily to scale, with emphasis instead generally being placed uponillustrating the principles of the present invention. Further, somefeatures may be exaggerated to show details of particular components.

The figures constitute a part of this specification and includeillustrative embodiments of the present invention and illustrate variousobjects and features thereof. Further, the figures are not necessarilyto scale, some features may be exaggerated to show details of particularcomponents. In addition, any measurements, specifications and the likeshown in the figures are intended to be illustrative, and notrestrictive. Therefore, specific structural and functional detailsdisclosed herein are not to be interpreted as limiting, but merely as arepresentative basis for teaching one skilled in the art to variouslyemploy the present invention.

Among those benefits and improvements that have been disclosed, otherobjects and advantages of this invention will become apparent from thefollowing description taken in conjunction with the accompanyingfigures. Detailed embodiments of the present invention are disclosedherein; however, it is to be understood that the disclosed embodimentsare merely illustrative of the invention that may be embodied in variousforms. In addition, each of the examples given in connection with thevarious embodiments of the invention which are intended to beillustrative, and not restrictive.

Throughout the specification and claims, the following terms take themeanings explicitly associated herein, unless the context clearlydictates otherwise. The phrases “in one embodiment” and “in someembodiments” as used herein do not necessarily refer to the sameembodiment(s), though they may. Furthermore, the phrases “in someembodiments” and “in some other embodiments” as used herein do notnecessarily refer to a different embodiment, although they may. Thus, asdescribed below, various embodiments of the invention may be readilycombined, without departing from the scope or spirit of the invention.

The term “based on” is not exclusive and allows for being based onadditional factors not described, unless the context clearly dictatesotherwise. In addition, throughout the specification, the meaning of“a,” “an,” and “the” include plural references. The meaning of “in”includes “in” and “on.”

Referring to FIGS. 1 through 2 , in some embodiments, a photovoltaicmodule 10 includes at least one solar cell 12, an encapsulant 14encapsulating the at least one solar cell 12, and a frontsheet 16juxtaposed with the encapsulant 14. In some embodiments, the frontsheet16 is juxtaposed with a first surface of the encapsulant 14. As usedherein, the terms “encapsulating” and “encapsulates” mean to partiallyor fully envelope or enclose, and with respect to certain embodiments ofthe photovoltaic module 10, the at least one solar cell 12 is fullyenveloped by or enclosed within the encapsulant 14, or partiallyenveloped by or enclosed within the encapsulant 14. In some embodiments,the at least one solar cell 12 includes a plurality of solar cells 12.In some embodiments, the at least one solar cell 12 is electricallyactive. In some embodiments, the photovoltaic module 10 includes a firstend 18, a second end 20 opposite the first end 18, a first surface 19extending from the first end 18 to the second end 20, and a secondsurface 21 opposite the first surface 19 and extending from the firstend 18 to the second end 20. In some embodiments, the first surface 19is an upper, sun facing-side surface of the photovoltaic module 10, andthe second surface 21 is a lower surface configured to face a roof deckon which the photovoltaic module 10 is installed.

In some embodiments, the encapsulant 14 may be made from polyolefins,ethyl vinyl acetates, ionomers, silicones, poly vinyl butyral, epoxies,polyurethanes, or combinations/hybrids thereof. In some embodiments, theencapsulant 14 is composed of thermosetting polyolefin. In someembodiments, the encapsulant 14 is composed of thermoplastic polyolefin.

In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.4 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.4 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.4 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.4 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.4 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.0 mm. Insome embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.9mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4mm to 0.7 mm. In some embodiments, the encapsulant 14 has a thickness of0.4 mm to 0.6 mm. In some embodiments, the encapsulant 14 has athickness of 0.4 mm to 0.5 mm.

In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.5 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.5 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.5 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.5 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.5 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.0 mm. Insome embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.9mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5mm to 0.7 mm. In some embodiments, the encapsulant 14 has a thickness of0.5 mm to 0.6 mm.

In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.6 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.6 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.6 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.6 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.6 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.0 mm. Insome embodiments, the encapsulant 14 has a thickness of 0.6 mm to 0.9mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6mm to 0.7 mm.

In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.7 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.7 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.7 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.7 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.7 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.0 mm. Insome embodiments, the encapsulant 14 has a thickness of 0.7 mm to 0.9mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to0.8 mm.

In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.8 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.8 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.8 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.8 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.8 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.0 mm. Insome embodiments, the encapsulant 14 has a thickness of 0.8 mm to 0.9mm.

In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of0.9 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 0.9 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 0.9 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 0.9 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 0.9 mm to 1.1 mm. In someembodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.0 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.0 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 1.0 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 1.0 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 1.0 mm to 1.2 mm. In some embodiments,the encapsulant 14 has a thickness of 1.0 mm to 1.1 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.1 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 1.1 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 1.1 mm to 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 1.1 mm to 1.2 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.2 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 1.2 mm to 1.4 mm. In some embodiments, the encapsulant 14has a thickness of 1.2 mm to 1.3 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.3 mm to 1.5 mm. In some embodiments, the encapsulant 14 has athickness of 1.3 mm to 1.4 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.4 mm to 1.5 mm.

In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.8mm. In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.5mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of1.6 mm to 1.8 mm. In some embodiments, the encapsulant 14 has athickness of 1.6 mm to 1.7 mm. In some embodiments, the encapsulant 14has a thickness of 1.7 mm to 1.8 mm. In some embodiments, theencapsulant 14 has a thickness of 0.4 mm. In some embodiments, theencapsulant 14 has a thickness of 0.5 mm. In some embodiments, theencapsulant 14 has a thickness of 0.6 mm. In some embodiments, theencapsulant 14 has a thickness of 0.7 mm. In some embodiments, theencapsulant 14 has a thickness of 0.8 mm. In some embodiments, theencapsulant 14 has a thickness of 0.9 mm. In some embodiments, theencapsulant 14 has a thickness of 1.0 mm. In some embodiments, theencapsulant 14 has a thickness of 1.1 mm. In some embodiments, theencapsulant 14 has a thickness of 1.2 mm. In some embodiments, theencapsulant 14 has a thickness of 1.3 mm. In some embodiments, theencapsulant 14 has a thickness of 1.4 mm. In some embodiments, theencapsulant 14 has a thickness of 1.5 mm. In some embodiments, theencapsulant 14 has a thickness of 1.6 mm. In some embodiments, theencapsulant 14 has a thickness of 1.7 mm. In some embodiments, theencapsulant 14 has a thickness of 1.8 mm.

In some embodiments, the frontsheet 16 includes a glass layer 22 and apolymer layer 24 attached to a first surface of the glass layer 22. Insome embodiments, the frontsheet 16 is juxtaposed with a first surfaceof the encapsulant 14. In some embodiments, each of the encapsulant 14,the glass layer 22, and the polymer layer 24 is transparent. In someembodiments, the polymer layer 24 is attached to the glass layer 22 byan adhesive layer 26. In some embodiments, the adhesive layer 26 mayinclude polyolefin elastomers (POE), polyvinyl butyrate, acrylic,silicone, or polycarbonate. In some embodiments, the adhesive layer 26may include pressure sensitive adhesives. In some embodiments, thepolymer layer 24 is attached to the glass layer 22 by thermal bonding.In some embodiments, the frontsheet 16 includes at least one of theglass layer 22 or the polymer layer 24. In some embodiments, theadhesive layer 26 is transparent. As used herein, the term “transparent”means having a solar weighted transmittance of 80% or greater, and withrespect to certain embodiments of the photovoltaic module 10, atransparent layer of the photovoltaic module has a solar weightedtransmittance of 80% or greater.

In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 4mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5mm to 3 mm. In some embodiments, the glass layer 22 has a thickness of 3mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of3.5 mm to 4 mm. In some embodiments, the glass layer 22 has a thicknessof 2.6 mm to 3.5 mm. In some embodiments, the glass layer 22 has athickness of 2.7 mm to 3.5 mm. In some embodiments, the glass layer 22has a thickness of 2.8 mm to 3.5 mm. In some embodiments, the glasslayer 22 has a thickness of 2.9 mm to 3.5 mm. In some embodiments, theglass layer 22 has a thickness of 3 mm to 3.5 mm. In some embodiments,the glass layer 22 has a thickness of 3.1 mm to 3.5 mm. In someembodiments, the glass layer 22 has a thickness of 3.2 mm to 3.5 mm. Insome embodiments, the glass layer 22 has a thickness of 3.3 mm to 3.5mm. In some embodiments, the glass layer 22 has a thickness of 3.4 mm to3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5mm to 3.4 mm. In some embodiments, the glass layer 22 has a thickness of2.5 mm to 3.3 mm. In some embodiments, the glass layer 22 has athickness of 2.5 mm to 3.2 mm. In some embodiments, the glass layer 22has a thickness of 2.5 mm to 3.1 mm. In some embodiments, the glasslayer 22 has a thickness of 2.5 mm to 2.9 mm. In some embodiments, theglass layer 22 has a thickness of 2.5 mm to 2.8 mm. In some embodiments,the glass layer 22 has a thickness of 2.5 mm to 2.7 mm. In someembodiments, the glass layer 22 has a thickness of 2.5 mm to 2.6 mm.

In some embodiments, the glass layer 22 has a thickness of 2.5 mm. Insome embodiments, the glass layer 22 has a thickness of 2.6 mm. In someembodiments, the glass layer 22 has a thickness of 2.7 mm. In someembodiments, the glass layer 22 has a thickness of 2.8 mm. In someembodiments, the glass layer 22 has a thickness of 2.9 mm. In someembodiments, the glass layer 22 has a thickness of 3 mm. In someembodiments, the glass layer 22 has a thickness of 3.1 mm. In someembodiments, the glass layer 22 has a thickness of 3.2 mm. In someembodiments, the glass layer 22 has a thickness of 3.3 mm. In someembodiments, the glass layer 22 has a thickness of 3.4 mm. In someembodiments, the glass layer 22 has a thickness of 3.5 mm. In someembodiments, the glass layer 22 has a thickness of 3.6 mm. In someembodiments, the glass layer 22 has a thickness of 3.7 mm. In someembodiments, the glass layer 22 has a thickness of 3.8 mm. In someembodiments, the glass layer 22 has a thickness of 3.9 mm. In someembodiments, the glass layer 22 has a thickness of 4 mm.

In some embodiments, the adhesive layer 26 includes thermosettingpolyolefin, thermosetting polyolefin encapsulant material, thermosettingethylene-vinyl acetate (EVA), EVA encapsulants, thermoplastic olefin,thermoplastic polyolefin (TPO) or hybrids/combinations thereof.

In some embodiments, the adhesive layer 26 has a thickness of 1 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of 1μm to 900 μm. In some embodiments, the adhesive layer 26 has a thicknessof 1 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 1 μm to 800 μm. In some embodiments, the adhesive layer 26has a thickness of 1 μm to 750 μm. In some embodiments, the adhesivelayer 26 has a thickness of 1 μm to 700 μm. In some embodiments, theadhesive layer 26 has a thickness of 1 μm to 650 μm. In someembodiments, the adhesive layer 26 has a thickness of 1 μm to 600 μm. Insome embodiments, the adhesive layer 26 has a thickness of 1 μm to 550μm. In some embodiments, the adhesive layer 26 has a thickness of 1 μmto 500 μm. In some embodiments, the adhesive layer 26 has a thickness of1 μm to 450 μm. In some embodiments, the adhesive layer 26 has athickness of 1 μm to 400 μm. In some embodiments, the adhesive layer 26has a thickness of 1 μm to 350 μm. In some embodiments, the adhesivelayer 26 has a thickness of 1 μm to 300 μm. In some embodiments, theadhesive layer 26 has a thickness of 1 μm to 250 μm. In someembodiments, the adhesive layer 26 has a thickness of 1 μm to 200 μm. Insome embodiments, the adhesive layer 26 has a thickness of 1 μm to 150μm. In some embodiments, the adhesive layer 26 has a thickness of 1 μmto 100 μm. In some embodiments, the adhesive layer 26 has a thickness of1 μm to 50 μm.

In some embodiments, the adhesive layer 26 has a thickness of 50 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of 50μm to 850 μm. In some embodiments, the adhesive layer 26 has a thicknessof 50 μm to 800 μm. In some embodiments, the adhesive layer 26 has athickness of 50 μm to 750 μm. In some embodiments, the adhesive layer 26has a thickness of 50 μm to 700 μm. In some embodiments, the adhesivelayer 26 has a thickness of 50 μm to 650 μm. In some embodiments, theadhesive layer 26 has a thickness of 50 μm to 600 μm. In someembodiments, the adhesive layer 26 has a thickness of 50 μm to 550 μm.In some embodiments, the adhesive layer 26 has a thickness of 50 μm to500 μm. In some embodiments, the adhesive layer 26 has a thickness of 50μm to 450 μm. In some embodiments, the adhesive layer 26 has a thicknessof 50 μm to 400 μm. In some embodiments, the adhesive layer 26 has athickness of 50 μm to 350 μm. In some embodiments, the adhesive layer 26has a thickness of 50 μm to 300 μm. In some embodiments, the adhesivelayer 26 has a thickness of 50 μm to 250 μm. In some embodiments, theadhesive layer 26 has a thickness of 50 μm to 200 μm. In someembodiments, the adhesive layer 26 has a thickness of 50 μm to 150 μm.In some embodiments, the adhesive layer 26 has a thickness of 50 μm to100 μm.

In some embodiments, the adhesive layer 26 has a thickness of 100 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of100 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 100 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 100 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 100 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 100 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 100 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of100 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 100 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 100 μm to 450 μm. In some embodiments, theadhesive layer 26 has a thickness of 100 μm to 400 μm. In someembodiments, the adhesive layer 26 has a thickness of 100 μm to 350 μm.In some embodiments, the adhesive layer 26 has a thickness of 100 μm to300 μm. In some embodiments, the adhesive layer 26 has a thickness of100 μm to 250 μm. In some embodiments, the adhesive layer 26 has athickness of 100 μm to 200 μm. In some embodiments, the adhesive layer26 has a thickness of 100 μm to 150 μm.

In some embodiments, the adhesive layer 26 has a thickness of 150 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of150 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 150 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 150 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 150 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 150 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 150 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of150 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 150 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 150 μm to 450 μm. In some embodiments, theadhesive layer 26 has a thickness of 150 μm to 400 μm. In someembodiments, the adhesive layer 26 has a thickness of 150 μm to 350 μm.In some embodiments, the adhesive layer 26 has a thickness of 150 μm to300 μm. In some embodiments, the adhesive layer 26 has a thickness of150 μm to 250 μm. In some embodiments, the adhesive layer 26 has athickness of 150 μm to 200 μm. In some embodiments, the adhesive layer26 has a thickness of 200 μm to 900 μm. In some embodiments, theadhesive layer 26 has a thickness of 200 μm to 850 μm. In someembodiments, the adhesive layer 26 has a thickness of 200 μm to 800 μm.In some embodiments, the adhesive layer 26 has a thickness of 200 μm to750 μm. In some embodiments, the adhesive layer 26 has a thickness of200 μm to 700 μm. In some embodiments, the adhesive layer 26 has athickness of 200 μm to 650 μm. In some embodiments, the adhesive layer26 has a thickness of 200 μm to 600 μm. In some embodiments, theadhesive layer 26 has a thickness of 200 μm to 550 μm. In someembodiments, the adhesive layer 26 has a thickness of 200 μm to 500 μm.In some embodiments, the adhesive layer 26 has a thickness of 200 μm to450 μm. In some embodiments, the adhesive layer 26 has a thickness of200 μm to 400 μm. In some embodiments, the adhesive layer 26 has athickness of 200 μm to 350 μm. In some embodiments, the adhesive layer26 has a thickness of 200 μm to 300 μm. In some embodiments, theadhesive layer 26 has a thickness of 200 μm to 250 μm.

In some embodiments, the adhesive layer 26 has a thickness of 250 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of250 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 250 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 250 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 250 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 250 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 250 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of250 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 250 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 250 μm to 450 μm. In some embodiments, theadhesive layer 26 has a thickness of 250 μm to 400 μm. In someembodiments, the adhesive layer 26 has a thickness of 250 μm to 350 μm.In some embodiments, the adhesive layer 26 has a thickness of 250 μm to300 μm.

In some embodiments, the adhesive layer 26 has a thickness of 300 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of300 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 300 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 300 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 300 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 300 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 300 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of300 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 300 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 300 μm to 450 μm. In some embodiments, theadhesive layer 26 has a thickness of 300 μm to 400 μm. In someembodiments, the adhesive layer 26 has a thickness of 300 μm to 350 μm.

In some embodiments, the adhesive layer 26 has a thickness of 350 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of350 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 350 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 350 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 350 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 350 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 350 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of350 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 350 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 350 μm to 450 μm. In some embodiments, theadhesive layer 26 has a thickness of 350 μm to 400 μm.

In some embodiments, the adhesive layer 26 has a thickness of 400 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of400 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 400 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 400 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 400 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 400 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 400 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of400 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 400 μm to 500 μm. In some embodiments, the adhesive layer26 has a thickness of 400 μm to 450 μm.

In some embodiments, the adhesive layer 26 has a thickness of 450 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of450 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 450 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 450 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 450 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 450 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 450 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of450 μm to 550 μm. In some embodiments, the adhesive layer 26 has athickness of 450 μm to 500 μm.

In some embodiments, the adhesive layer 26 has a thickness of 500 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of500 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 500 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 500 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 500 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 500 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 500 μm to600 μm. In some embodiments, the adhesive layer 26 has a thickness of500 μm to 550 μm.

In some embodiments, the adhesive layer 26 has a thickness of 550 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of550 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 550 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 550 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 550 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 550 μm to 650 μm.In some embodiments, the adhesive layer 26 has a thickness of 550 μm to600 μm.

In some embodiments, the adhesive layer 26 has a thickness of 600 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of600 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 600 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 600 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 600 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 600 μm to 650 μm.

In some embodiments, the adhesive layer 26 has a thickness of 650 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of650 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 650 μm to 800 μm. In some embodiments, the adhesive layer26 has a thickness of 650 μm to 750 μm. In some embodiments, theadhesive layer 26 has a thickness of 650 μm to 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 700 μm to 900 μm.In some embodiments, the adhesive layer 26 has a thickness of 700 μm to850 μm. In some embodiments, the adhesive layer 26 has a thickness of700 μm to 800 μm. In some embodiments, the adhesive layer 26 has athickness of 700 μm to 750 μm. In some embodiments, the adhesive layer26 has a thickness of 750 μm to 900 μm. In some embodiments, theadhesive layer 26 has a thickness of 750 μm to 850 μm. In someembodiments, the adhesive layer 26 has a thickness of 750 μm to 800 μm.In some embodiments, the adhesive layer 26 has a thickness of 800 μm to900 μm. In some embodiments, the adhesive layer 26 has a thickness of800 μm to 850 μm. In some embodiments, the adhesive layer 26 has athickness of 850 μm to 900 μm.

In some embodiments, the adhesive layer 26 has a thickness of 1 μm. Insome embodiments, the adhesive layer 26 has a thickness of 50 μm. Insome embodiments, the adhesive layer 26 has a thickness of 100 μm. Insome embodiments, the adhesive layer 26 has a thickness of 1 μm. In someembodiments, the adhesive layer 26 has a thickness of 150 μm. In someembodiments, the adhesive layer 26 has a thickness of 200 μm. In someembodiments, the adhesive layer 26 has a thickness of 250 μm. In someembodiments, the adhesive layer 26 has a thickness of 300 μm. In someembodiments, the adhesive layer 26 has a thickness of 350 μm. In someembodiments, the adhesive layer 26 has a thickness of 400 μm. In someembodiments, the adhesive layer 26 has a thickness of 450 μm. In someembodiments, the adhesive layer 26 has a thickness of 500 μm. In someembodiments, the adhesive layer 26 has a thickness of 550 μm. In someembodiments, the adhesive layer 26 has a thickness of 600 μm. In someembodiments, the adhesive layer 26 has a thickness of 650 μm. In someembodiments, the adhesive layer 26 has a thickness of 700 μm. In someembodiments, the adhesive layer 26 has a thickness of 750 μm. In someembodiments, the adhesive layer 26 has a thickness of 800 μm. In someembodiments, the adhesive layer 26 has a thickness of 850 μm. In someembodiments, the adhesive layer 26 has a thickness of 900 μm.

In some embodiments, the polymer layer 24 includes a fluoropolymer. Incertain embodiments, the fluoropolymer may be ethylenetetrafluoroethylene (ETFE), fluoropolymer is polyvinylidene fluoride(PVDF), tetrafluoroethylene-hexafluoropropylene copolymers (FEP), andtetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers(THV), polyvinyl fluoride (PVF), or blends thereof. In some embodiments,the frontsheet includes fluoropolymers, acrylics, polyesters, silicones,polycarbonates, or combinations thereof. In other embodiments, thepolymer layer 24 includes polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polyetheretherketone (PEEK), polyaryletherketone(PAEK), polyarylate (PAR), polyetherimide (PEI), polyarylsulfone (PAS),polyethersulfone (PES), polyamideimide (PAI), polyphenylsulfone (PPSU),polyolefin, cyclic olefin copolymers (CPCs), or polyimide. In someembodiments, the polymer layer 24 includes a crosslinked polymericmaterial. In some embodiments, 50% to 99% of the polymer chains of thepolymeric material are crosslinked.

In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to0.5 mm. In some embodiments, the polymer layer 24 has a thickness of0.01 mm to 0.4 mm. In some embodiments, the polymer layer 24 has athickness of 0.01 mm to 0.3 mm. In some embodiments, the polymer layer24 has a thickness of 0.01 mm to 0.2 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.01 mm to 0.1 mm. In someembodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.09 mm.In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to0.08 mm. In some embodiments, the polymer layer 24 has a thickness of0.01 mm to 0.07 mm. In some embodiments, the polymer layer 24 has athickness of 0.01 mm to 0.06 mm. In some embodiments, the polymer layer24 has a thickness of 0.01 mm to 0.05 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.01 mm to 0.04 mm. In someembodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.03 mm.In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to0.02 mm.

In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to0.4 mm. In some embodiments, the polymer layer 24 has a thickness of0.02 mm to 0.4 mm. In some embodiments, the polymer layer 24 has athickness of 0.03 mm to 0.4 mm. In some embodiments, the polymer layer24 has a thickness of 0.04 mm to 0.4 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.05 mm to 0.4 mm. In someembodiments, the polymer layer 24 has a thickness of 0.06 mm to 0.4 mm.In some embodiments, the polymer layer 24 has a thickness of 0.07 mm to0.4 mm. In some embodiments, the polymer layer 24 has a thickness of0.08 mm to 0.4 mm. In some embodiments, the polymer layer 24 has athickness of 0.09 mm to 0.4 mm. In some embodiments, the polymer layer24 has a thickness of 0.1 mm to 0.4 mm. In some embodiments, the polymerlayer 24 has a thickness of 0.15 mm to 0.4 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.2 mm to 0.4 mm. In someembodiments, the polymer layer 24 has a thickness of 0.25 mm to 0.4 mm.In some embodiments, the polymer layer 24 has a thickness of 0.3 mm to0.4 mm. In some embodiments, the polymer layer 24 has a thickness of0.35 mm to 0.4 mm.

In some embodiments, the polymer layer 24 has a thickness of 0.025 mm to0.1 mm. In some embodiments, the polymer layer 24 has a thickness of0.03 mm to 0.1 mm. In some embodiments, the polymer layer 24 has athickness of 0.035 mm to 0.1 mm. In some embodiments, the polymer layer24 has a thickness of 0.04 mm to 0.1 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.045 mm to 0.1 mm. In someembodiments, the polymer layer 24 has a thickness of 0.05 mm to 0.1 mm.In some embodiments, the polymer layer 24 has a thickness of 0.06 mm to0.1 mm. In some embodiments, the polymer layer 24 has a thickness of0.065 mm to 0.1 mm. In some embodiments, the polymer layer 24 has athickness of 0.07 mm to 0.1 mm. In some embodiments, the polymer layer24 has a thickness of 0.075 mm to 0.1 mm. In some embodiments, thepolymer layer 24 has a thickness of 0.08 mm to 0.1 mm. In someembodiments, the polymer layer 24 has a thickness of 0.085 mm to 0.1 mm.In some embodiments, the polymer layer 24 has a thickness of 0.09 mm to0.1 mm. In some embodiments, the polymer layer 24 has a thickness of0.095 mm to 0.1 mm.

In some embodiments, the frontsheet 16 includes only the glass layer 22.In some embodiments, the frontsheet 16 includes only the polymer layer24.

Referring to FIGS. 1, 3A and 3B, in some embodiments, a backsheet 28 isjuxtaposed with a second surface of the encapsulant 14. In someembodiments, the backsheet 28 includes a first surface 30, a secondsurface 32 opposite the first surface 30, a first side 34, a second side36 opposite the first side 34, a first edge 38 extending from the firstside 34 to the second side 36, and a second edge 40 opposite the firstedge 38 and extending from the first side 34 to the second side 36.

In some embodiments, the backsheet 28 includes a first section 42 and asecond section 44. In some embodiments, the first section 42 istransparent. In some embodiments, the second section 44 isnon-transparent (opaque). In some embodiments, the first section 42extends from the first edge 38 to a first location 46 intermediate thefirst edge 38 and the second edge 40. In some embodiments, the firstsection 42 extends from the first edge 38 to the first location 46 andfrom the first side 34 to the second side 36. In some embodiments, thefirst section 42 extends from the first edge 38 to the first location46, from the first side 34 to the second side 36, and from the firstsurface 30 to the second surface 32. In some embodiments, the secondsection 44 extends from the first location 46 to the second edge 40. Insome embodiments, the second section 44 extends from the first location46 to the second edge 40 and from the first side 34 to the second side36. In some embodiments, the second section 44 extends from the firstlocation 46 to the second edge 40, from the first side 34 to the secondside 36, and from the first surface 30 to the second surface 32.

In some embodiments, the first section 42 includes a width W1 measuredfrom the first edge 38 to the first location 46. In some embodiments,the width W1 is 5 mm to 30 mm. In some embodiments, the width W1 is 5 mmto 25 mm. In some embodiments, the width W1 is 5 mm to 20 mm. In someembodiments, the width W1 is 5 mm to 15 mm. In some embodiments, thewidth W1 is 5 mm to 10 mm. In some embodiments, the width W1 is 10 mm to30 mm. In some embodiments, the width W1 is 10 mm to 25 mm. In someembodiments, the width W1 is 10 mm to 20 mm. In some embodiments, thewidth W1 is 10 mm to 15 mm. In some embodiments, the width W1 is 15 mmto 30 mm. In some embodiments, the width W1 is 15 mm to 25 mm. In someembodiments, the width W1 is 15 mm to 20 mm. In some embodiments, thewidth W1 is 20 mm to 30 mm. In some embodiments, the width W1 is 20 mmto 25 mm. In some embodiments, the width W1 is 25 mm to 30 mm. In someembodiments, the width W1 is 5 mm. In some embodiments, the width W1 is10 mm. In some embodiments, the width W1 is 15 mm. In some embodiments,the width W1 is 20 mm. In some embodiments, the width W1 is 25 mm. Insome embodiments, the width W1 is 30 mm.

Referring to FIG. 3B, in some embodiments, the backsheet 28 includes athird section 48 that extends from the second edge 40 to a secondlocation 50 intermediate the second edge 40 and the first edge 38. Insome embodiments, the third section 48 extends from the second edge 40to the second location 50 and from the first side 34 to the second side36. In some embodiments, the third section 48 extends from the secondedge 40 to the second location 50, from the first side 34 to the secondside 36, and from the first surface 30 to the second surface 32.

In some embodiments, the second section 44 extends from the firstlocation 46 to the second location 50. In some embodiments, the secondsection 44 extends from the first location 46 to the second location 50and from the first side 34 to the second side 36. In some embodiments,the second section 44 extends from the first location 46 to the secondlocation 50, from the first side 34 to the second side 36, and from thefirst surface 30 to the second surface 32.

In some embodiments, the backsheet 28 includes thermoplastic polyolefin(TPO). In some embodiments, the backsheet 28 includes a single ply TPOroofing membrane. In other embodiments, non-limiting examples of TPOmembranes are disclosed in U.S. Pat. No. 9,359,014 to Yang et al., whichis incorporated by reference herein in its entirety. In someembodiments, the backsheet 28 includes polyvinyl chloride. In someembodiments, the backsheet 28 includes ethylene propylene diene monomer(EPDM) rubber. In some embodiments, the backsheet 28 includes a flameretardant additive. In some embodiments, the flame retardant additivemay be clays, nanoclays, silicas, carbon black, metal hydroxides such asaluminum hydroxide, metal foils, graphite, and combinations thereof. Insome embodiments, the backsheet 28 includes polyethylene terephthalate(PET). In some embodiments, the backsheet 28 includes ethylenetetrafluoroethylene (ETFE). In some embodiments, the backsheet 28includes tetrafluoroethylene-hexafluoropropylene copolymers (FEP). Insome embodiments, the backsheet 28 includes ethylenechlorotrifluoroethylene (ECTFE).

In some embodiments, the backsheet 28 has a thickness of 2 mil to 100mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to90 mil. In some embodiments, the backsheet 28 has a thickness of 2 milto 80 mil. In some embodiments, the backsheet 28 has a thickness of 2mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of2 mil to 60 mil. In some embodiments, the backsheet 28 has a thicknessof 2 mil to 50 mil. In some embodiments, the backsheet 28 has athickness of 2 mil to 40 mil. In some embodiments, the backsheet 28 hasa thickness of 2 mil to 30 mil. In some embodiments, the backsheet 28has a thickness of 2 mil to 20 mil. In some embodiments, the backsheet28 has a thickness of 2 mil to 10 mil. In some embodiments, thebacksheet 28 has a thickness of 10 mil to 100 mil. In some embodiments,the backsheet 28 has a thickness of 10 mil to 90 mil. In someembodiments, the backsheet 28 has a thickness of 10 mil to 80 mil. Insome embodiments, the backsheet 28 has a thickness of 10 mil to 70 mil.In some embodiments, the backsheet 28 has a thickness of 10 mil to 60mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to50 mil. In some embodiments, the backsheet 28 has a thickness of 10 milto 40 mil. In some embodiments, the backsheet 28 has a thickness of 10mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of10 mil to 20 mil.

In some embodiments, the backsheet 28 has a thickness of 20 mil to 100mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to90 mil. In some embodiments, the backsheet 28 has a thickness of 20 milto 80 mil. In some embodiments, the backsheet 28 has a thickness of 20mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of20 mil to 60 mil. In some embodiments, the backsheet 28 has a thicknessof 20 mil to 50 mil. In some embodiments, the backsheet 28 has athickness of 20 mil to 40 mil. In some embodiments, the backsheet 28 hasa thickness of 20 mil to 30 mil. In some embodiments, the backsheet 28has a thickness of 30 mil to 100 mil. In some embodiments, the backsheet28 has a thickness of 30 mil to 90 mil. In some embodiments, thebacksheet 28 has a thickness of 30 mil to 80 mil. In some embodiments,the backsheet 28 has a thickness of 30 mil to 70 mil. In someembodiments, the backsheet 28 has a thickness of 30 mil to 60 mil. Insome embodiments, the backsheet 28 has a thickness of 30 mil to 50 mil.In some embodiments, the backsheet 28 has a thickness of 30 mil to 40mil.

In some embodiments, the backsheet 28 has a thickness of 40 mil to 100mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to90 mil. In some embodiments, the backsheet 28 has a thickness of 40 milto 80 mil. In some embodiments, the backsheet 28 has a thickness of 40mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of40 mil to 60 mil. In some embodiments, the backsheet 28 has a thicknessof 40 mil to 50 mil. In some embodiments, the backsheet 28 has athickness of 50 mil to 100 mil. In some embodiments, the backsheet 28has a thickness of 50 mil to 90 mil. In some embodiments, the backsheet28 has a thickness of 50 mil to 80 mil. In some embodiments, thebacksheet 28 has a thickness of 50 mil to 70 mil. In some embodiments,the backsheet 28 has a thickness of 50 mil to 60 mil.

In some embodiments, the backsheet 28 has a thickness of 60 mil to 100mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to90 mil. In some embodiments, the backsheet 28 has a thickness of 60 milto 80 mil. In some embodiments, the backsheet 28 has a thickness of 60mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of70 mil to 100 mil. In some embodiments, the backsheet 28 has a thicknessof 70 mil to 90 mil. In some embodiments, the backsheet 28 has athickness of 70 mil to 80 mil. In some embodiments, the backsheet 28 hasa thickness of 80 mil to 100 mil. In some embodiments, the backsheet 28has a thickness of 80 mil to 90 mil. In some embodiments, the backsheet28 has a thickness of 90 mil to 100 mil.

In some embodiments, the backsheet 28 has a thickness of 2 mil. In someembodiments, the backsheet 28 has a thickness of 10 mil. In someembodiments, the backsheet 28 has a thickness of 20 mil. In someembodiments, the backsheet 28 has a thickness of 30 mil. In someembodiments, the backsheet 28 has a thickness of 40 mil. In someembodiments, the backsheet 28 has a thickness of 50 mil. In someembodiments, the backsheet 28 has a thickness of 60 mil. In someembodiments, the backsheet 28 has a thickness of 10 mil. In someembodiments, the backsheet 28 has a thickness of 70 mil. In someembodiments, the backsheet 28 has a thickness of 80 mil. In someembodiments, the backsheet 28 has a thickness of 90 mil. In someembodiments, the backsheet 28 has a thickness of 100 mil.

In some embodiments, the second section 44 of the backsheet 28 ispainted. In some embodiments, the second section 44 of the backsheet 28is painted an opaque color. In some embodiments, the second section 44of the backsheet 28 includes an opaque color printed thereon.

Referring to FIG. 1 , in some embodiments, the photovoltaic module 10includes an adhesive 52. In some embodiments, the adhesive 52 isattached to the second surface 32 of the backsheet 28. In someembodiments, the adhesive 52 is transparent. In some embodiments, theadhesive 52 is located proximate to the first section 42. In someembodiments, the adhesive 52 is juxtaposed with the first section 42. Insome embodiments, edges 54 a, 54 b of the adhesive 52 are substantiallyaligned with corresponding edges 56 a, 56 b of the first section 42. Insome embodiments, the edges 54 a, 54 b of the adhesive 52 are alignedwith the edges 56 a, 56 b of the first section 42.

In some embodiments, the adhesive 52 is located proximate to the thirdsection 48. In some embodiments, the adhesive 52 is juxtaposed with thethird section 48. In some embodiments, the edges 54 a, 54 b of theadhesive 52 are substantially aligned with edges 58 a, 58 b of the thirdsection 48. In some embodiments, the edges 54 a, 54 b of the adhesive 52are aligned with the edges 58 a, 58 b of the third section 48.

In some embodiments, the adhesive 52 is silicone. In some embodiments,the adhesive 52 is a tape. In some embodiments, the adhesive 52 is VHBtape supplied by 3M. In some embodiments, the adhesive 52 is an acrylicadhesive. In some embodiments, the adhesive 52 is a urethane adhesive.In some embodiments, the adhesive 52 is an epoxy. In some embodiments,the adhesive 52 is butyl. In some embodiments, the adhesive 52 is apoly-vinyl acetate (PVA) adhesive.

In some embodiments, the adhesive 52 is applied to the photovoltaicmodule 10 during the manufacture thereof. In some embodiments, theadhesive 52 is applied to the photovoltaic module 10 during theinstallation of the photovoltaic module 10 on a roof deck.

In some embodiments, the adhesive 52 has a thickness of 1 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 90mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 80mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 70mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 60mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 50mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 40mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 30mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 20mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 10mil.

In some embodiments, the adhesive 52 has a thickness of 10 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to90 mil. In some embodiments, the adhesive 52 has a thickness of 10 milto 80 mil. In some embodiments, the adhesive 52 has a thickness of 10mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of10 mil to 60 mil. In some embodiments, the adhesive 52 has a thicknessof 10 mil to 50 mil. In some embodiments, the adhesive 52 has athickness of 10 mil to 40 mil. In some embodiments, the adhesive 52 hasa thickness of 10 mil to 30 mil. In some embodiments, the adhesive 52has a thickness of 10 mil to 20 mil.

In some embodiments, the adhesive 52 has a thickness of 20 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to90 mil. In some embodiments, the adhesive 52 has a thickness of 20 milto 80 mil. In some embodiments, the adhesive 52 has a thickness of 20mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of20 mil to 60 mil. In some embodiments, the adhesive 52 has a thicknessof 20 mil to 50 mil. In some embodiments, the adhesive 52 has athickness of 20 mil to 40 mil. In some embodiments, the adhesive 52 hasa thickness of 20 mil to 30 mil.

In some embodiments, the adhesive 52 has a thickness of 30 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to90 mil. In some embodiments, the adhesive 52 has a thickness of 30 milto 80 mil. In some embodiments, the adhesive 52 has a thickness of 30mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of30 mil to 60 mil. In some embodiments, the adhesive 52 has a thicknessof 30 mil to 50 mil. In some embodiments, the adhesive 52 has athickness of 30 mil to 40 mil.

In some embodiments, the adhesive 52 has a thickness of 40 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to90 mil. In some embodiments, the adhesive 52 has a thickness of 40 milto 80 mil. In some embodiments, the adhesive 52 has a thickness of 40mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of40 mil to 60 mil. In some embodiments, the adhesive 52 has a thicknessof 40 mil to 50 mil. In some embodiments, the adhesive 52 has athickness of 50 mil to 100 mil. In some embodiments, the adhesive 52 hasa thickness of 50 mil to 90 mil. In some embodiments, the adhesive 52has a thickness of 50 mil to 80 mil. In some embodiments, the adhesive52 has a thickness of 50 mil to 70 mil. In some embodiments, theadhesive 52 has a thickness of 50 mil to 60 mil.

In some embodiments, the adhesive 52 has a thickness of 60 mil to 100mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to90 mil. In some embodiments, the adhesive 52 has a thickness of 60 milto 80 mil. In some embodiments, the adhesive 52 has a thickness of 60mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of70 mil to 100 mil. In some embodiments, the adhesive 52 has a thicknessof 70 mil to 90 mil. In some embodiments, the adhesive 52 has athickness of 70 mil to 80 mil. In some embodiments, the adhesive 52 hasa thickness of 80 mil to 100 mil. In some embodiments, the adhesive 52has a thickness of 80 mil to 90 mil. In some embodiments, the adhesive52 has a thickness of 90 mil to 100 mil.

In some embodiments, the adhesive 52 has a thickness of 1 mil. In someembodiments, the adhesive 52 has a thickness of 10 mil. In someembodiments, the adhesive 52 has a thickness of 20 mil. In someembodiments, the adhesive 52 has a thickness of 30 mil. In someembodiments, the adhesive 52 has a thickness of 40 mil. In someembodiments, the adhesive 52 has a thickness of 50 mil. In someembodiments, the adhesive 52 has a thickness of 60 mil. In someembodiments, the adhesive 52 has a thickness of 70 mil. In someembodiments, the adhesive 52 has a thickness of 80 mil. In someembodiments, the adhesive 52 has a thickness of 90 mil. In someembodiments, the adhesive 52 has a thickness of 100 mil.

In some embodiments, the adhesive 52 optically couples the photovoltaicmodule 10 with another photovoltaic module. In some embodiments, theadhesive 52 mechanically couples the photovoltaic module 10 with anotherphotovoltaic module overlayed by the photovoltaic module 10. As usedherein and with respect to certain embodiments of the photovoltaicmodule 10, the term “optically couples” means each of a firstphotovoltaic module and a second photovoltaic module include a structureand an installed position such that solar light is capable of beingtransmitted through the first photovoltaic module to the secondphotovoltaic module.

In some embodiments, the adhesive 52 has a solar weighted transmissionof 50% to 100%. In some embodiments, the adhesive 52 has a solarweighted transmission of 50% to 95%. In some embodiments, the adhesive52 has a solar weighted transmission of 50% to 90%. In some embodiments,the adhesive 52 has a solar weighted transmission of 50% to 80%. In someembodiments, the adhesive 52 has a solar weighted transmission of 50% to70%. In some embodiments, the adhesive 52 has a solar weightedtransmission of 50% to 60%. In some embodiments, the adhesive 52 has asolar weighted transmission of 60% to 100%. In some embodiments, theadhesive 52 has a solar weighted transmission of 60% to 90%. In someembodiments, the adhesive 52 has a solar weighted transmission of 60% to80%. In some embodiments, the adhesive 52 has a solar weightedtransmission of 60% to 70%. In some embodiments, the adhesive 52 has asolar weighted transmission of 70% to 100%. In some embodiments, theadhesive 52 has a solar weighted transmission of 70% to 90%. In someembodiments, the adhesive 52 has a solar weighted transmission of 70% to80%. In some embodiments, the adhesive 52 has a solar weightedtransmission of 80% to 100%. In some embodiments, the adhesive 52 has asolar weighted transmission of 80% to 90%. In some embodiments, theadhesive 52 has a solar weighted transmission of 90% to 100%.

In some embodiments, the adhesive 52 has a solar weighted transmissionof 50%. In some embodiments, the adhesive 52 has a solar weightedtransmission of 60%. In some embodiments, the adhesive 52 has a solarweighted transmission of 70%. In some embodiments, the adhesive 52 has asolar weighted transmission of 80%. In some embodiments, the adhesive 52has a solar weighted transmission of 90%. In some embodiments, theadhesive 52 has a solar weighted transmission of 95%. In someembodiments, the adhesive 52 has a solar weighted transmission of 99.9%.In some embodiments, the adhesive 52 has a solar weighted transmissionof 100%.

In some embodiments, the adhesive 52 has an index of refraction of 1 to1.7. In some embodiments, the adhesive 52 has an index of refraction of1 to 1.6. In some embodiments, the adhesive 52 has an index ofrefraction of 1 to 1.5. In some embodiments, the adhesive 52 has anindex of refraction of 1 to 1.4. In some embodiments, the adhesive 52has an index of refraction of 1 to 1.3. In some embodiments, theadhesive 52 has an index of refraction of 1 to 1.2. In some embodiments,the adhesive 52 has an index of refraction of 1 to 1.1.

In some embodiments, the adhesive 52 has an index of refraction of 1.1to 1.7. In some embodiments, the adhesive 52 has an index of refractionof 1.1 to 1.6. In some embodiments, the adhesive 52 has an index ofrefraction of 1.1 to 1.5. In some embodiments, the adhesive 52 has anindex of refraction of 1.1 to 1.4. In some embodiments, the adhesive 52has an index of refraction of 1.1 to 1.3. In some embodiments, theadhesive 52 has an index of refraction of 1.1 to 1.2. In someembodiments, the adhesive 52 has an index of refraction of 1.2 to 1.7.In some embodiments, the adhesive 52 has an index of refraction of 1.2to 1.6. In some embodiments, the adhesive 52 has an index of refractionof 1.2 to 1.5. In some embodiments, the adhesive 52 has an index ofrefraction of 1.2 to 1.4. In some embodiments, the adhesive 52 has anindex of refraction of 1.2 to 1.3.

In some embodiments, the adhesive 52 has an index of refraction of 1.3to 1.7. In some embodiments, the adhesive 52 has an index of refractionof 1.3 to 1.6. In some embodiments, the adhesive 52 has an index ofrefraction of 1.3 to 1.5. In some embodiments, the adhesive 52 has anindex of refraction of 1.3 to 1.4. In some embodiments, the adhesive 52has an index of refraction of 1.4 to 1.7. In some embodiments, theadhesive 52 has an index of refraction of 1.4 to 1.6. In someembodiments, the adhesive 52 has an index of refraction of 1.4 to 1.5.In some embodiments, the adhesive 52 has an index of refraction of 1.5to 1.7. In some embodiments, the adhesive 52 has an index of refractionof 1.5 to 1.6. In some embodiments, the adhesive 52 has an index ofrefraction of 1.6 to 1.7.

In some embodiments, the adhesive 52 has an index of refraction of 1. Insome embodiments, the adhesive 52 has an index of refraction of 1.1. Insome embodiments, the adhesive 52 has an index of refraction of 1.2. Insome embodiments, the adhesive 52 has an index of refraction of 1.3. Insome embodiments, the adhesive 52 has an index of refraction of 1.4. Insome embodiments, the adhesive 52 has an index of refraction of 1.5. Insome embodiments, the adhesive 52 has an index of refraction of 1.6. Insome embodiments, the adhesive 52 has an index of refraction of 1.7.

In some embodiments, at least one solar cell 12 includes a first end 60and a second end 62 opposite the first end 60. In some embodiments, thefirst end 60 is located proximate to the first end 18 of thephotovoltaic module 10. In some embodiments, the second end 62 islocated proximate to the second end 20 of the photovoltaic module 10.

Referring to FIG. 4 , in some embodiments, a transparent portion 64(transparent edge) is formed by a portion of the frontsheet 16, aportion of the encapsulant 14, the first section 42 of the backsheet 28,and the adhesive 52. In some embodiments, the transparent portion 64extends from the first surface 19 to a surface 23 of the adhesive 52. Insome embodiments, a creepage distance D1 extends from the first end 18of the photovoltaic module 10 to the first end 60 of the at least onesolar cell 12. In some embodiments, the creepage distance D1 is equal tothe width W1 of the first section 42 of the backsheet 28. In someembodiments, the creepage distance D1 extends from the second end 20 ofthe photovoltaic module 10 to the second end 62 of the at least onesolar cell 12.

Referring to FIGS. 4 through 6 , in some embodiments, a system includesa plurality of the photovoltaic modules 10 installed on a roof deck. Insome embodiments, the plurality of photovoltaic modules 10 includes afirst photovoltaic module 10 a and a second photovoltaic module 10 b. Insome embodiments, a portion of the first photovoltaic module 10 aoverlays a portion of the second photovoltaic module 10 b. In someembodiments, the first end 18 of the first photovoltaic module 10 aoverlays the second end 20 of the second photovoltaic module 10 b. Insome embodiments, the transparent portion 64 of the first photovoltaicmodule 10 a overlays a portion of the at least one solar cell 12 at thesecond end 62 thereof. In some embodiments, the transparent portion 64overlaps the at least one solar cell 12 at an overlap distance D2. Insome embodiments, the overlap distance D2 is equal to the creepagedistance D1. In some embodiments, the overlap distance D2 is less thanthe creepage distance D1. In some embodiments, the adhesive 52 of thefirst photovoltaic module 10 a is attached to the first surface 19 ofthe second photovoltaic module 10 b. In some embodiments, the totalamount of overlap D3 of the first photovoltaic module 10 a over thesecond photovoltaic module 10 b is twice the creepage distance D1. Insome embodiments, the total amount of overlap D3 of the firstphotovoltaic module 10 a over the second photovoltaic module 10 b isapproximately twice the creepage distance D1. In some embodiments, thereveal D4 of the second photovoltaic module 10 b is equal to the lengthof the at least one solar cell 12. In some embodiments, the reveal D4 ofthe second photovoltaic module 10 b is approximately equal to the lengthof the at least one solar cell 12.

In some embodiments, solar light transmission L travels throughtransparent portion 64 (the frontsheet 16, the encapsulant 14, the firstsection 42 of the backsheet 28 and the adhesive 52) of the firstphotovoltaic module 10 a and through the frontsheet 16 and theencapsulant 14 of the second photovoltaic module 10 b to the at leastone solar cell 12 of the second photovoltaic module 10 b. In someembodiments, a power density (PD) of an array of the photovoltaicmodules 10 is relative to the proportion of the area covered by solarcells 12. In some embodiments, the power density (PD) is calculated as:PD=n*S/(2C+n*S)where C=creepage distance D1, S=the length of the at least one solarcell 12, and n=number of the photovoltaic modules 10 in the array. Insome embodiments, for relatively large numbers of the photovoltaicmodules 10 in the array (for example, with n=10 or greater), theproportion of the total array height covered by the solar cells 12approaches 100%. In some embodiments, if C=15 mm, S=166 mm, n=10, thenPD=98%.

FIG. 6 shows an embodiment of a photovoltaic module 110. Thephotovoltaic module 110 has a structure and function similar to those ofthe photovoltaic module 10, with certain differences described below. Insome embodiments, the photovoltaic module 110 includes at least onesolar cell 112, an encapsulant 114 encapsulating the at least one solarcell 112, a frontsheet 116 juxtaposed with a first surface of theencapsulant 114, and a backsheet 128 juxtaposed with a second surface ofthe encapsulant 114. In some embodiments, the backsheet 128 istransparent. In some embodiments, the entire area of the backsheet 128is transparent.

In some embodiments, the photovoltaic module 110 includes an adhesive152. In some embodiments, the adhesive 152 is attached to a surface 132of the backsheet 128. In some embodiments, the adhesive 152 istransparent. In some embodiments, the adhesive 152 is located proximateto a first end 118 of the photovoltaic module 110. In some embodiments,the adhesive 152 is located proximate to a second end 120 of thephotovoltaic module 110.

In some embodiments, a transparent portion 164 is formed by thefrontsheet 116, the encapsulant 114, the backsheet 128, and the adhesive152. In some embodiments, the transparent portion 164 extends from afirst surface 119 to the second surface 121 of the photovoltaic module110. In some embodiments, a creepage distance D1 extends from the firstend 118 of the photovoltaic module 110 to a first end 160 of the atleast one solar cell 112.

FIG. 7 shows an embodiment of a photovoltaic module 210. Thephotovoltaic module 210 has a structure and function similar to those ofthe photovoltaic module 10, with certain differences described below. Insome embodiments, the photovoltaic module 210 includes at least onesolar cell 212, an encapsulant 214 encapsulating the at least one solarcell 212, and a frontsheet 216 juxtaposed with a first surface of theencapsulant 214. In some embodiments, a backsheet 228 is juxtaposed witha second surface of the encapsulant 214.

In some embodiments, the backsheet 228 includes a first layer 229 and asecond layer 231. In some embodiments, the first layer 229 is juxtaposedwith the second surface of the encapsulant 214. In some embodiments, thefirst layer 229 extends from a first end 218 of the photovoltaic module210 to a second end 220 of the photovoltaic module 210, In someembodiments, the first layer 229 is transparent. In some embodiments,the first layer 229 includes polyethylene terephthalate (PET). In someembodiments, the first layer 229 includes ethylene tetrafluoroethylene(ETFE). In some embodiments, the first layer 229 includestetrafluoroethylene-hexafluoropropylene copolymers (FEP). In someembodiments, the first layer 229 includes ethylenechlorotrifluoroethylene (ECTFE).

In some embodiments, the second layer 231 is juxtaposed with the firstlayer 229. In some embodiments, the second layer 231 extends from thesecond end 220 to a first location 246 intermediate the first end 218and the second end 220. In some embodiments, the second layer 231 isnon-transparent. In some embodiments, the second layer 231 is attachedto the first layer 229 by an adhesive layer 233. In some embodiments,the adhesive layer 233 extends from the second end 220 to the firstlocation 246.

In some embodiments, an adhesive 252 is attached to a surface 232 of thefirst layer 229. In some embodiments, the adhesive 252 extends from thefirst end 218 to the first location 246. In some embodiments, theadhesive 252 is juxtaposed with an end of the second layer 231 and anend of the adhesive layer 233. In some embodiments, a thickness T1 ofthe adhesive 252 is equal to a total thickness of the second layer 231and the adhesive layer 233. In some embodiments, the thickness T1 of theadhesive 252 is greater than a total thickness T2 of the second layer231 and the adhesive layer 233. In some embodiments, the adhesive layer233 is transparent. In some embodiments, the adhesive layer 233 has astructure similar to that of the adhesive layer 26. In some embodiments,the adhesive layer 233 is selected from the group consisting ofpolyvinyl butyrate, acrylic, silicone, and polycarbonate adhesives. Insome embodiments, the adhesive layer 233 is selected from the groupconsisting of thermosetting polyolefin, thermosetting polyolefinencapsulant material, thermosetting ethylene-vinyl acetate (EVA), EVAencapsulants, thermoplastic olefin, thermoplastic polyolefin (TPO) andhybrids and combinations thereof. In some embodiments, the adhesivelayer 233 includes a thermosetting polyolefin encapsulant material. Insome embodiments, the adhesive layer 233 includes a thickness of 1 μm to900 μm. In some embodiments, the adhesive layer 233 includes a thicknessin the same subranges as identified above with respect to the adhesivelayer 26.

In some embodiments, a transparent portion 264 is formed by a portion ofthe frontsheet 216, a portion of the encapsulant 214, a portion of thefirst layer 229 of the backsheet 228, and the adhesive 252. In someembodiments, the transparent portion 264 extends from a first surface219 to a second surface 221 of the photovoltaic module 210. In someembodiments, a creepage distance D1 extends from the first end 218 ofthe photovoltaic module 210 to the first end 260 of the at least onesolar cell 212. In some embodiments, the creepage distance D1 is equalto a width W1 of the adhesive 252.

In some embodiments, the adhesive 252 is silicone. In some embodiments,the adhesive 252 is a tape. In some embodiments, the adhesive 252 is VHBtape supplied by 3M. In some embodiments, the adhesive 252 is an acrylicadhesive. In some embodiments, the adhesive 252 is a urethane adhesive.In some embodiments, the adhesive 252 is an epoxy. In some embodiments,the adhesive 252 is butyl. In some embodiments, the adhesive 252 is apoly-vinyl acetate (PVA) adhesive. In some embodiments, the adhesive 252is applied to the photovoltaic module 210 during the manufacturethereof. In some embodiments, the adhesive 252 is applied to thephotovoltaic module 210 during the installation of the photovoltaicmodule 210 on a roof deck. In some embodiments, the adhesive 252optically couples the photovoltaic module 210 with another photovoltaicmodule. In some embodiments, the adhesive 252 mechanically couples thephotovoltaic module 210 with another photovoltaic module overlayed bythe photovoltaic module 210.

FIG. 8 shows a side schematic view of embodiments of a system of aplurality of photovoltaic modules 310 a, 310 b. In some embodiments, thephotovoltaic modules 310 a, 310 b have a structure, function andarrangement similar to those of the photovoltaic modules 10 a, 10 b,with certain differences described below. In some embodiments, thephotovoltaic module 310 a includes an encapsulant 314 having a surface315 and a backsheet 328 juxtaposed with the surface 315 of theencapsulant 314. In some embodiments, the backsheet 328 includes a firstsurface 330, a second surface 332 opposite the first surface 330, afirst edge 338, and a second edge 340 opposite the first edge 338. Insome embodiments, the backsheet 328 is transparent. In some embodiments,the backsheet 328 is non-transparent. In some embodiments, the backsheet328 includes a beveled portion 345. In some embodiments, the beveledportion 345 extends from the first edge 338 to a location 347intermediate the first edge 338 and the second edge 340. In someembodiments, the beveled portion 345 has a width W1. In someembodiments, the width W1 extends from the first edge 338 to thelocation 347. In some embodiments, the width W1 is equal to an overlapdistance D2. In some embodiments, the width W1 is substantially equal tothe overlap distance D2. In some embodiments, the width W1 is greaterthan the overlap distance D2. In some embodiments, the width W1 is lessthan the overlap distance D2.

In some embodiments, the beveled portion 345 is beveled at an angle A of5 degrees to 30 degrees relative to a lower surface 315 of theencapsulant 314. In some embodiments, the angle A is 5 degrees to 25degrees. In some embodiments, the angle A is 5 degrees to 20 degrees. Insome embodiments, the angle A is 5 degrees to 15 degrees. In someembodiments, the angle A is 5 degrees to 10 degrees. In someembodiments, the angle A is 10 degrees to 30 degrees. In someembodiments, the angle A is 10 degrees to 25 degrees. In someembodiments, the angle A is 10 degrees to 20 degrees. In someembodiments, the angle A is 10 degrees to 15 degrees. In someembodiments, the angle A is 15 degrees to 30 degrees. In someembodiments, the angle A is 15 degrees to 25 degrees. In someembodiments, the angle A is 15 degrees to 20 degrees. In someembodiments, the angle A is 20 degrees to 30 degrees. In someembodiments, the angle A is 20 degrees to 25 degrees. In someembodiments, the angle A is 25 degrees to 30 degrees.

In some embodiments, the photovoltaic modules 310 a, 310 b are installedon a roof deck surface of a steep slope roof. As defined herein, a“steep slope roof” is any roof substrate that is disposed on a roofhaving a pitch of Y/X, where Y and X are in a ratio of 2:12 to 18:12,where Y corresponds to the “rise” of the roof, and where X correspondsto the “run” of the roof.

In some embodiments, Y and X are in a ratio of 5:12 to 12:12. In someembodiments, Y and X are in a ratio of 6:12 to 12:12. In someembodiments, Y and X are in a ratio of 7:12 to 12:12. In someembodiments, Y and X are in a ratio of 6:12 to 12:12. In someembodiments, Y and X are in a ratio of 8:12 to 12:12. In someembodiments, Y and X are in a ratio of 6:12 to 12:12. In someembodiments, Y and X are in a ratio of 9:12 to 12:12. In someembodiments, Y and X are in a ratio of 10:12 to 12:12. In someembodiments, Y and X are in a ratio of 11:12 to 12:12.

In some embodiments, Y and X are in a ratio of 4:12 to 11:12. In someembodiments, Y and X are in a ratio of 4:12 to 10:12. In someembodiments, Y and X are in a ratio of 4:12 to 9:12. In someembodiments, Y and X are in a ratio of 4:12 to 8:12. In someembodiments, Y and X are in a ratio of 4:12 to 7:12. In someembodiments, Y and X are in a ratio of 4:12 to 6:12. In someembodiments, Y and X are in a ratio of 4:12 to 5:12. In someembodiments, Y and X are in a ratio of 5:12 to 11:12. In someembodiments, Y and X are in a ratio of 6:12 to 10:12. In someembodiments, Y and X are in a ratio of 7:12 to 9:12. In someembodiments, Y and X are in a ratio of 2:12. In some embodiments, Y andX are in a ratio of 3:12.

In some embodiments, light enters an area between an upper surface 319of the photovoltaic module 310 b and the beveled portion 345 of thephotovoltaic module 310 a. In some embodiments, the light reaches atleast a portion 313 of at least one solar cell 312 of the photovoltaicmodule 310 b.

Referring to FIG. 9 , in some embodiments, the backsheet 328 includes areflective portion 349. In some embodiment, the reflective portion 349is located on the surface 332 of the backsheet 328. In some embodiments,the reflective portion 349 extends from the first edge 338 to a location351 between the first edge 338 and the second edge 340. In someembodiment, the reflective portion 349 includes the beveled portion 345.In some embodiments, the reflective portion 349 has a width W2. In someembodiments, the width W2 extends from the first edge 338 to thelocation 351. In some embodiments, the width W2 is equal to the overlapD3. In some embodiments, the width W2 is substantially equal to theoverlap D3. In some embodiments, the width W2 is greater than theoverlap D3. In some embodiments, the width W2 is less than the overlapD3.

In some embodiments, the reflective portion 349 includes a reflectivecolor. In some embodiments, the reflective color is white. In someembodiment, the reflective portion 349 is painted. In some embodiments,the reflective portion 349 includes a pigment. In some embodiments, thecolor of the reflective portion 349 is printed. In some embodiments,reflected light intensity in the area A1 overlapped by the reflectiveportion 349 will depend on the angle of solar incidence (i.e., acombination of roof pitch and solar elevation), and the width W2. Insome embodiments, the more bounces the light has to go through to reachthe solar cell 312, the lower the intensity. In some embodiments, thewidth W2 is less than 1 times a thickness T of the frontsheet 316. Insome embodiments, the width W2 is less than 2 times the thickness T ofthe frontsheet 316. In some embodiments, the width W2 is less than 3times a thickness T of the frontsheet 316.

While a number of embodiments of the present invention have beendescribed, it is understood that these embodiments are illustrativeonly, and not restrictive, and that many modifications may becomeapparent to those of ordinary skill in the art. Further still, thevarious steps may be carried out in any desired order (and any desiredsteps may be added and/or any desired steps may be eliminated).

What is claimed is:
 1. A system, comprising: a plurality of photovoltaicmodules installed on a roof deck, each of the photovoltaic modulesincludes at least one solar cell; an encapsulant encapsulating the atleast one solar cell, wherein the encapsulant includes an end, a firstside, and a second side, wherein the encapsulant is transparent; afrontsheet above the first side of the encapsulant, wherein thefrontsheet includes an end, wherein the frontsheet is transparent; and abacksheet below the second side of the encapsulant, wherein thebacksheet includes a first section, and a second section adjacent thefirst section, wherein the first section is transparent, wherein thesecond section is non-transparent, wherein the end of the frontsheet,the end of the encapsulant, and the first section of the backsheet forma transparent portion, wherein the transparent portion of a firstphotovoltaic module of the plurality of photovoltaic modules overlays atleast a portion of the at least one solar cell of a second photovoltaicmodule of the plurality of photovoltaic modules.
 2. The system of claim1, wherein each of the photovoltaic modules includes a first edge, and asecond edge opposite the first edge, wherein the first section extendsfrom the first edge to a first location intermediate the first edge andthe second edge, and wherein the second section extends from the firstlocation to the second edge.
 3. The system of claim 2, wherein thebacksheet includes a first surface, a second surface opposite the firstsurface of the backsheet, a first side extending from the first edge tothe second edge, and a second side opposite the first side and extendingfrom the first edge to the second edge, wherein the first sectionextends from the first side to the second side and from the firstsurface to the second surface.
 4. The system of claim 3, wherein thesecond section extends from the first side to the second side and fromthe first surface of the backsheet to the second surface of thebacksheet.
 5. The system of claim 2, wherein the first section includesa width measured from the first edge to the first location.
 6. Thesystem of claim 5, wherein the width is 5 mm to 30 mm.
 7. The system ofclaim 1, wherein each of the plurality of photovoltaic modules includesan adhesive juxtaposed with the backsheet, and wherein the adhesive istransparent.
 8. The system of claim 7, wherein the adhesive isjuxtaposed with the first section.
 9. The system of claim 7, wherein theadhesive is substantially aligned with the first section.
 10. The systemof claim 7, wherein the adhesive optically couples the firstphotovoltaic module with the second photovoltaic module.
 11. The systemof claim 5, wherein each of the photovoltaic modules includes a creepagedistance extending from the first edge to a first end of the at leastone solar cell.
 12. The system of claim 11, wherein the creepagedistance is equal to the width of the first section of the backsheet.13. The system of claim 11, wherein the transparent portion of the firstphotovoltaic module overlays the at least one solar cell at an overlapdistance.
 14. The system of claim 13, wherein the overlap distance isless than or equal to the creepage distance.
 15. The system of claim 11,wherein the first photovoltaic module overlaps the second photovoltaicmodule of a distance twice the creepage distance.
 16. The system ofclaim 1, wherein the first section includes a first layer and the secondsection includes a second layer.
 17. The system of claim 16, whereineach of the photovoltaic modules includes a first edge, and a secondedge opposite the first edge, wherein the first layer extends from thefirst edge to the second edge, and wherein the second layer extends fromthe second edge to a first location intermediate the first edge and thesecond edge.
 18. A photovoltaic module, comprising: at least one solarcell; an encapsulant encapsulating the at least one solar cell, whereinthe encapsulant includes an end, a first side, and a second side,wherein the encapsulant is transparent; a frontsheet above the firstside of the encapsulant, wherein the frontsheet includes an end, whereinthe frontsheet is transparent; and a backsheet below the second side ofthe encapsulant, wherein the backsheet includes a first section, and asecond section adjacent the first section, wherein the first section istransparent, wherein the second section is non-transparent, wherein theend of the frontsheet, the end of the encapsulant, and the first sectionof the backsheet form a transparent portion, wherein the transparentportion of the photovoltaic module is configured to overlay at least aportion of at least one solar cell of another photovoltaic module.